Welcome to the 2027 International Conference on Advanced Semiconductor and Chip Design (ICASCD 2027)! We are delighted to have you join us from December 10–12, 2027.
As the semiconductor industry continues to push the boundaries of Moore's Law, advanced materials, novel device architectures, and intelligent chip design methodologies are redefining the future of electronics. ICASCD 2027 brings together leading researchers, engineers, and industry professionals from around the globe to explore cutting-edge advancements in wide-bandgap semiconductors, emerging device technologies, chip design automation, heterogeneous integration, and next-generation manufacturing processes.
We warmly invite you to join us in China this December for this exciting event, and look forward to your contributions and inspiring discussions.
The First Round
Abstract Submission Due: June 12, 2027
Full Paper Submission Due: June 26, 2027
Author Notification Due: August 7, 2027
Registration Due: September 18, 2027
Final Paper Submission Due: October 30, 2027
Main Conference: December 10–12, 2027
*Note: All dates refer to Beijing Time (CST, UTC+8).
Prospective authors are welcome to submit their research paper to ICASCD 2027 through the online submission system. (Please try to use Google Chrome if you encounter any issues during your submission or registration process. You may also contact us at 028-85575979 for any assistance.)
(to be updated)
It's necessary for all the submitted papers to adhere to the conference written paper format. For the detail format information, please download here:
Topics of Interest include but are not limited to:
·Wide-Bandgap and Ultra-Wide-Bandgap Semiconductors (SiC, GaN, Ga₂O₃, Diamond, AlN, etc.)
·2D Materials and Emerging Semiconductors (Graphene, MoS₂, etc.)
·Advanced CMOS, FinFET, GAA-FET, Nanosheet/Nanowire Transistors
·Beyond-CMOS and Emerging Device Architectures (TFET, Negative Capacitance FET, etc.)
·Quantum Materials and Topological Materials
·Semiconductor Manufacturing Processes and Process Integration
·Extreme Ultraviolet (EUV) Lithography and Next-Generation Patterning Technologies
·Thin-Film Deposition and Epitaxial Growth Technologies
·Semiconductor Metrology, Inspection, and Defect Characterization
Registered and presented full papers will be included in the ICASCD 2027 digital conference proceedings and submitted to major citation databases (including, but not limited to Ei Compendex and Scopus) for review and indexing.
Participants Registration & Conference Kits Collection
Keynote Session & Parallel Session
Excursion/Social Event
550USD/4000CNY
Regular Registration
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