Please download the CFP flyer here 
(will be available soon).
Topics of Interest include but are not limited to:
| Advanced Semiconductor Materials and Manufacturing | Chip Design, EDA, and System Integration |
| ·Wide-Bandgap and Ultra-Wide-Bandgap Semiconductors (SiC, GaN, Ga₂O₃, Diamond, etc.) ·2D Materials and Emerging Semiconductors (Graphene, MoS₂, etc.) ·Advanced CMOS, FinFET, GAA-FET, Nanosheet/Nanowire Transistors ·Beyond-CMOS and Emerging Device Architectures (TFET, Negative Capacitance FET, etc.) ·Quantum Materials and Topological Materials ·Semiconductor Manufacturing Processes and Process Integration ·Extreme Ultraviolet (EUV) Lithography and Next-Generation Patterning Technologies ·Thin-Film Deposition and Epitaxial Growth Technologies ·Semiconductor Metrology, Inspection, and Defect Characterization ·Yield Enhancement, Process Control, and Manufacturing Optimization ·Wide-Bandgap Device Fabrication and Process Technology ·Advanced Packaging Technologies (2.5D/3D, Fan-Out, Si Photonics, etc.) |
·High-Performance and Low-Power Processor Design ·System-on-Chip (SoC) and Network-on-Chip (NoC) ·3D-IC and Chiplet-Based Heterogeneous Integration ·AI-Driven Chip Architecture and Hardware Acceleration ·Memory-Centric, In-Memory, and Near-Memory Computing Architectures ·Domain-Specific Accelerators for AI, Edge, IoT, and Automotive ·Analog, Mixed-Signal, and RF IC Design ·EDA Algorithm Innovation and Design Automation ·Design-Technology Co-Optimization (DTCO) and System-Technology Co-Optimization (STCO) ·Hardware Security, Anti-Counterfeit, and Physical Unclonable Functions (PUF) ·Design for Testability (DFT), Built-In Self-Test (BIST), and Chip Testing ·Chip Reliability, Aging, Thermal Management, and 3D Thermal-Aware Design |